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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6761 Issued Date : 1994.10.06 Revised Date : 2002.02.26 Page No. : 1/3
HTIP50
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP50 is designed for line operated audio output amplifier switch-mode power supply drivers and other switching applications.
Absolute Maximum Ratings (Ta=25C)
TO-220
* Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 40 W Total Power Dissipation (Ta=25C) ....................................................................................... 2 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage..................................................................................... 500 V BVCEO Collector to Emitter Voltage.................................................................................. 400 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current............................................................................................................... 1 A
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO IEBO ICEO ICES *VCE(sat) VBE(on) *hFE1 *hFE2 fT Min. 500 400 5 30 10 10 Typ. Max. 1 1 1 1 1.5 150 Unit V V V mA mA mA V V Test Conditions IC=1mA, IE=0 IC=30mA, IB=0 IE=0.1mA, IC=0 VEB=5V, IC=0 VCE=300V, IB=0 VCE=500V, VEB=0 IC=1A, IB=0.2A IC=1A, VCE=10V IC=0.3A, VCE=10V IC=1A, VCE=10V IC=0.2A, VCB=10V, f=2MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz
HTIP50
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 hFE @ VCE=10V 1000 VCE(sat) @ IC=5IB
Spec. No. : HE6761 Issued Date : 1994.10.06 Revised Date : 2002.02.26 Page No. : 2/3
Saturation Voltage & Collector Current
hFE
125 C 100 25 C 75 C
o o
o
Saturation Voltage (mV)
100 125 C
o
75 C 25 C
o
o
10 1 10 100 1000
10 1 10 100 1000
Collector Current-IC (mA)
Collector Current-IC (mA)
ON Voltage & Collector Current
1000 25 C
o
Cutoff Frequency & Collector Current
100
VCE=10V
ON Voltage (mV)
75 C
o
125 C
o
VBE(ON) @ VCE=10V
100 1 10 100 1000
Cutoff Frequency (MHz).. .
10 1 10 100 1000
Collector Current-IC (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100 10
Safe Operating Area
PT=1ms PT=100ms PT=1s
Collector Current-IC (mA)
1
Capacitance (pF)
10
0.1
Cob
0.01
1 1 10 100
0.001 1 10 100 1000
Reverse Biased Voltage (V)
Forward Voltage-VCE (V)
HTIP50
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
A D B E C
Date Code H 50
Spec. No. : HE6761 Issued Date : 1994.10.06 Revised Date : 2002.02.26 Page No. : 3/3
TIP
Control Code
H I G 4 P M 3 2 1 N K
Style: Pin 1.Base 2.Collector 3.Emitter
O
3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical
DIM A B C D E G H
Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398
Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25
DIM I K M N O P
Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248
Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTIP50
HSMC Product Specification

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